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Thu, 28 Mar 2024 22:49:59 +0700Thu, 28 Mar 2024 22:49:59 +0700en Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus
https://eprints.uet.vnu.edu.vn/eprints/id/eprint/2731/
National Institute Of Advanced Industrial Science And Technology (2017) Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus. US9627347 B2. Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications
https://eprints.uet.vnu.edu.vn/eprints/id/eprint/839/
Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Watanabe, Naoya and Nemoto, Shunsuke and Kikuchi, Katsuya and Aoyagi, Masahiro (2013) Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications. In: 2013 IEEE Electronic Components and Technology Conference, 2013, Las Vegas, USA. Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration
https://eprints.uet.vnu.edu.vn/eprints/id/eprint/837/
Bui, Thanh Tung and Suzuki, Motohiro and Kato, Fumiki and Nemoto, Shunsuke and Watanabe, Naoki and Aoyagi, Masahiro (2013) Sub-Micron-Accuracy Gold-to-Gold Interconnection Flip-Chip Bonding Approach for Electronics–Optics Heterogeneous Integration. Japanese Journal of Applied Physics, 52 (4S). 04CB08. ISSN 0021-4922