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Polymeric Thermal Microactuator With Embedded Silicon Skeleton: Part II - Fabrication, Characterization, and Application for 2-DOF Microgripper

Chu, Duc-Trinh and Lau, Gih-Keong and Sarro, P.M. (2008) Polymeric Thermal Microactuator With Embedded Silicon Skeleton: Part II - Fabrication, Characterization, and Application for 2-DOF Microgripper. Microelectromechanical Systems, Journal of, 17 (4). pp. 823-831.

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Abstract

This paper presents the fabrication, characterization, and application of a novel silicon-polymer laterally stacked electrothermal microactuator. The actuator consists of a deep silicon skeleton structure with a thin-film aluminum heater on top and filled polymer in the trenches among the vertical silicon parts. The fabrication is based on deep reactive ion etching, aluminum sputtering, SU8 filling, and KOH etching. The actuator is 360 mum long, 125 mum wide, and 30 mum thick. It generates a large in-plane forward motion up to 9 mum at a driving voltage of 2.5 V using low power consumption and low operating temperature. A novel 2-D microgripper based on four such forward actuators is introduced. The microgripper jaws can be moved along both the x- and y-axes up to 17 and 11 mum, respectively. The microgripper can grasp a microobject with a diameter from 6 to 40 mum. In addition, the proposed design is suitable for rotation of the clamped object both clockwise and counterclockwise.

Item Type: Article
Uncontrolled Keywords: elemental semiconductors;etching;filled polymers;grippers;microactuators;silicon;sputter deposition;2-D microgripper;KOH etching;SU8 filling;Si;aluminum sputtering;deep reactive ion etching;driving voltage;filled polymer;operating temperature;power consumption;silicon skeleton structure;silicon-polymer laterally stacked electrothermal microactuator;size 125 mum;size 30 mum;size 360 mum;thin-film aluminum heater;2-D microgripper;Electrothermal microactuator;SU8;polymeric microactuator;
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Divisions: Faculty of Electronics and Telecommunications (FET)
Depositing User: Prof. Xuan-Tu Tran
Date Deposited: 31 Dec 2013 10:03
Last Modified: 12 Dec 2017 13:59
URI: http://eprints.uet.vnu.edu.vn/eprints/id/eprint/222

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