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An on-communication multiple-TSV defects detection and localization for real-time 3D-ICs

Dang, Nam Khanh and Ahmed, Akram Ben and Tran, Xuan Tu (2019) An on-communication multiple-TSV defects detection and localization for real-time 3D-ICs. In: 2019 IEEE 13th International Symposium on embedded Multicore/Manycore Systems-on-Chip (IEEE MCSoC-2019), 1-3 October 2019, Singapore. (In Press)

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This paper presents “On Communication Through- Silicon-Via Test” (OCTT), an ECC-based method to localize faults without halting the operation of TSV-based 3D-IC systems. OCTT consists of two major parts named Statistical Detector and Isolation and Check. While Statistical Detector could detect open and short defects in TSVs that work without interrupting data transactions, the Isolation and Check algorithm enhances the ability to localize fault position. The Monte-Carlo simulations of Statistical Detector show x2 increment in the number of detected faults when compared to conventional ECC-based techniques. While Isolation and Ch eck helps localize the number of defects up to x4 and x5 higher. In addition, the worst case execution time is below 65,000 cycles with no performance degradation for testing which could be easily integrated into real-time applications.

Item Type: Conference or Workshop Item (Paper)
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Information Technology (IT)
Divisions: Faculty of Electronics and Telecommunications (FET)
Key Laboratory for Smart Integrated Systems (SISLAB)
Depositing User: Khanh N. Dang
Date Deposited: 16 Sep 2019 02:12
Last Modified: 16 Sep 2019 02:12

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