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Thermal distribution and reliability prediction for 3D Networks-on-Chip

Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip. VNU Journal of Computer Science and Communication Engineering . ISSN 0866-8612

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Item Type: Article
Subjects: Electronics and Communications
Electronics and Communications > Electronics and Computer Engineering
Divisions: Key Laboratory for Smart Integrated Systems (SISLAB)
Depositing User: Khanh N. Dang
Date Deposited: 05 Jun 2020 02:03
Last Modified: 05 Jun 2020 02:03
URI: http://eprints.uet.vnu.edu.vn/eprints/id/eprint/3960

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