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Items where Author is "Xiaojin, Cheng"

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Article

Bui, Thanh Tung and Naoya, Watanabe and Xiaojin, Cheng and Fumiki, Kato and Katsuya, Kikuchi and Masahiro, Aoyagi (2016) Copper-Filled Through-Silicon Vias with Parylene-HT Liner. IEEE Transactions on Components, Packaging, and Manufacturing Technology, 6 (4). pp. 510-517. ISSN 2156-3950

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