?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.au=Feng%2C+Wei&rft.aulast=Feng&rft.aufirst=Wei&rft.date=1+May+2016&rft.issn=0026-2714&rft.atitle=Fabrication+and+stress+analysis+of+annular-trench-isolated+TSV&rft.title=Microelectronics+Reliability&rft.genre=article