?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.au=Bui%2C+Thanh+Tung&rft.aulast=Bui&rft.aufirst=Thanh+Tung&rft.issue=4&rft.volume=6&rft.date=1+April+2016&rft.issn=2156-3950&rft.atitle=Copper-Filled+Through-Silicon+Vias+with+Parylene-HT+Liner&rft.title=IEEE+Transactions+on+Components%2C+Packaging%2C+and+Manufacturing+Technology&rft.pages=510-517&rft.genre=article