relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/1617/
title: Thermal simulation for evaluation of thermal comfort in real houses
creator: Konlakorn, Wongpatikaseree
creator: Nguyen, Hoai Son
creator: Yasuo, Tan
subject: Information Technology (IT)
date: 2015
type: Conference or Workshop Item
type: PeerReviewed
identifier:   Konlakorn, Wongpatikaseree and Nguyen, Hoai Son and Yasuo, Tan  (2015) Thermal simulation for evaluation of thermal comfort in real houses.  In: SGSH 2015: Smart Grid and Smart Home.