eprintid: 1617
rev_number: 10
eprint_status: archive
userid: 21
dir: disk0/00/00/16/17
datestamp: 2016-06-02 01:53:12
lastmod: 2016-06-02 01:53:12
status_changed: 2016-06-02 01:53:12
type: conference_item
metadata_visibility: show
creators_name: Konlakorn, Wongpatikaseree
creators_name: Nguyen, Hoai Son
creators_name: Yasuo, Tan
creators_id: sonnh@vnu.edu.vn
title: Thermal simulation for evaluation of thermal comfort in real houses
ispublished: pub
subjects: IT
divisions: fac_fit
date: 2015
date_type: published
full_text_status: none
pres_type: paper
event_title: SGSH 2015: Smart Grid and Smart Home
event_type: workshop
refereed: TRUE
citation:   Konlakorn, Wongpatikaseree and Nguyen, Hoai Son and Yasuo, Tan  (2015) Thermal simulation for evaluation of thermal comfort in real houses.  In: SGSH 2015: Smart Grid and Smart Home.