@inproceedings{SisLab2326,
       booktitle = {2016 IEEE 66th Electronic Components and Technology Conference (ECTC)},
           title = {A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration},
          author = {Thanh Tung Bui and Xiaojin Cheng and Naoya Watanabe and Fumiki Kato and Katsuya Kikuchi and Masahiro Aoyagi},
            year = {2016},
           pages = {2182--2187},
             doi = {doi:10.1109/ECTC.2016.344},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/2326/}
}