?url_ver=Z39.88-2004&rft_id=doi%3A10.1109%2FECTC.2016.344&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.au=Bui%2C+Thanh+Tung&rft.aulast=Bui&rft.aufirst=Thanh+Tung&rft.date=2016&rft.title=A+Prospective+Low-k+Insulator+for+Via-Last+through-Silicon-Vias+(TSVs)+in+3D+Integration&rft.btitle=2016+IEEE+66th+Electronic+Components+and+Technology+Conference+(ECTC)&rft.genre=proceeding