relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/2326/
title: A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration
creator: Bui, Thanh Tung
creator: Cheng, Xiaojin
creator: Watanabe, Naoya
creator: Kato, Fumiki
creator: Kikuchi, Katsuya
creator: Aoyagi, Masahiro
subject: Electronics and Communications
date: 2016
type: Conference or Workshop Item
type: PeerReviewed
identifier:   Bui, Thanh Tung and Cheng, Xiaojin and Watanabe, Naoya and Kato, Fumiki and Kikuchi, Katsuya and Aoyagi, Masahiro  (2016) A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration.  In: 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 2016.     
relation: http://doi.org/10.1109/ECTC.2016.344
relation: doi:10.1109/ECTC.2016.344