%0 Conference Paper
%A Bui, Thanh Tung
%A Cheng, Xiaojin
%A Watanabe, Naoya
%A Kato, Fumiki
%A Kikuchi, Katsuya
%A Aoyagi, Masahiro
%B 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
%D 2016
%F SisLab:2326
%P 2182-2187
%T A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/2326/