TY  - CONF
ID  - SisLab2326
UR  - http://doi.org/10.1109/ECTC.2016.344
A1  - Bui, Thanh Tung
A1  - Cheng, Xiaojin
A1  - Watanabe, Naoya
A1  - Kato, Fumiki
A1  - Kikuchi, Katsuya
A1  - Aoyagi, Masahiro
Y1  - 2016///
TI  - A Prospective Low-k Insulator for Via-Last through-Silicon-Vias (TSVs) in 3D Integration
SP  - 2182
AV  - none
EP  - 2187
T2  - 2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
ER  -