@article{SisLab2729,
          volume = {7},
          number = {9},
           month = {September},
          author = {Ying Ying Lim and Yee Mey Goh and Manabu Yoshida and Thanh Tung Bui and Masahiro Aoyagi and Changqing Liu},
           title = {30-GHz High-Frequency Application of Screen Printed Interconnects on an Organic Substrate},
         journal = {IEEE Transactions on Components, Packaging and Manufacturing Technology},
           pages = {1506--1515},
            year = {2017},
        keywords = {Conductivity, DC conductivity, Coplanar waveguides, Radio frequency, Transmission line measurements, transmission lines, Power transmission lines, Printing, radio frequency (RF) performance, screen printing, silver nanoparticle paste, Substrates},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/2729/},
        abstract = {Printed conductive traces on flexible substrates offer many potential applications in the area of wearable electronics, ranging from search and rescue operations to health and physiological monitoring. The literature abounds on the effect of sintering conditions on the dc electrical resistivity of printed traces, due to the applications considered which fall in the lower frequency domain (megahertz range). There is a growing interest to investigate wireless body area networks for wearable electronics operating in the higher frequencies, due to the advantages involved. At present, there is a little information available on the radio frequency performance of printed interconnects, and this work seeks to investigate the effect of the paste property on the dc conductivity and high-frequency performance ( \${$\backslash$}textbackslashle 30\$ GHz) of interconnects. The results obtained suggest that paste leveling has a significant influence on the dc electrical performance. In addition, the dc conductivity values are possibly affected by the adhesion of the paste onto the particular substrate during the printing process, which was observed to have a significant effect on the quality and thicknesses of the traces printed. Last, the influence of the dc conductivity on the high-frequency performance of interconnects is investigated, where the measured results are validated with simulation results.}
}