relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/2729/
title: 30-GHz High-Frequency Application of Screen Printed Interconnects on an Organic Substrate
creator: Lim, Ying Ying
creator: Goh, Yee Mey
creator: Yoshida, Manabu
creator: Bui, Thanh Tung
creator: Aoyagi, Masahiro
creator: Liu, Changqing
subject: ISI-indexed journals
description: Printed conductive traces on flexible substrates offer many potential applications in the area of wearable electronics, ranging from search and rescue operations to health and physiological monitoring. The literature abounds on the effect of sintering conditions on the dc electrical resistivity of printed traces, due to the applications considered which fall in the lower frequency domain (megahertz range). There is a growing interest to investigate wireless body area networks for wearable electronics operating in the higher frequencies, due to the advantages involved. At present, there is a little information available on the radio frequency performance of printed interconnects, and this work seeks to investigate the effect of the paste property on the dc conductivity and high-frequency performance ( $\textbackslashle 30$ GHz) of interconnects. The results obtained suggest that paste leveling has a significant influence on the dc electrical performance. In addition, the dc conductivity values are possibly affected by the adhesion of the paste onto the particular substrate during the printing process, which was observed to have a significant effect on the quality and thicknesses of the traces printed. Last, the influence of the dc conductivity on the high-frequency performance of interconnects is investigated, where the measured results are validated with simulation results.
date: 2017-09
type: Article
type: PeerReviewed
identifier:   Lim, Ying Ying and Goh, Yee Mey and Yoshida, Manabu and Bui, Thanh Tung and Aoyagi, Masahiro and Liu, Changqing  (2017) 30-GHz High-Frequency Application of Screen Printed Interconnects on an Organic Substrate.  IEEE Transactions on Components, Packaging and Manufacturing Technology, 7  (9).   pp. 1506-1515.