<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "Architecture and Design Methodology for Highly-Reliable TSV-NoC Systems"^^ . "During the past few decades, a lot of research has been focusing on Three-dimensional\r\nNetworks-on-Chips (3D-NoCs) as an auspicious solution to alleviate the interconnect bottleneck\r\nand reduce the power consumption in current System-on-Chips (SoCs) designs.\r\nHowever, 3D-NoC systems are becoming susceptible to a variety of faults caused by\r\ncrosstalk, radiation, oxide breakdown, and so on. As a result, a simple failure in a single\r\ntransistor caused by one of these factors may compromise the entire system reliability\r\nwhere the failure can be illustrated in corrupted message delivery, time requirement unsatisfactory,\r\nor even sometimes the whole system collapse. This chapter presents a detailed faults/defects analysis and an efficient reliability assessment method to approximate the lifetime reliability of a NoC system. Also, this chapter presents an architecture and hardware design of a fault-tolerant TSV based 3D-NoC system which can handle major failures (i.e., hard-faults, soft-errors and TSV-defects) that can occur in TSV-based 3D-NoC systems."^^ . "2018-02" . "16" . . "Nova Science Publishers"^^ . . "Nova Science Publishers"^^ . . . . . . . . . . . "Abderazek Ben"^^ . "Abdallah"^^ . "Abderazek Ben Abdallah"^^ . . "Nam Khanh"^^ . "Dang"^^ . "Nam Khanh Dang"^^ . . . . . "HTML Summary of #3006 \n\nArchitecture and Design Methodology for Highly-Reliable TSV-NoC Systems\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . .