eprintid: 3008
rev_number: 9
eprint_status: archive
userid: 375
dir: disk0/00/00/30/08
datestamp: 2018-06-18 08:04:05
lastmod: 2018-06-18 08:04:05
status_changed: 2018-06-18 08:04:05
type: conference_item
metadata_visibility: show
creators_name: Abdallah, Abderazek Ben
creators_name: Dang, Nam Khanh
creators_name: Okuyama, Yuichi
creators_id: benab@u-aizu.ac.jp
creators_id: dnk0904@gmail.com
title: A Low-overhead Fault tolerant Technique for TSV-based Interconnects in 3D-IC Systems
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: lab_sis
abstract: 3D-Network-on-Chips (3D-NoCs) are considered as one of the most advanced and auspicious communication methodologies for future IC designs by exploiting the benefits of Network-on-Chips (NoCs) and 3D-Integrated Circuits (3D-ICs). However, their reliability still remains a major problem due to the vulnerability of Through Silicon Vias (TSVs). Because most of the existing techniques rely on correcting the TSV defects by using redundancy or employing routing algorithms, the TSV-cluster defect tolerances encounter costly area and power consumption penalties. In order to solve this issue, we propose a highly scalable and low-overhead TSV management for 3D-NoC systems where the TSVs of a router can be utilized by its neighbors and an adaptive online algorithm is also performed to assist. With this proposal, we aim to maintain a graceful performance for 3D-NoCs without the need for redundant links or employing routing algorithms.
date: 2017
full_text_status: none
pres_type: paper
event_title: Sciences and Techniques of Automatic Control and Computer Engineering (STA), 2017 18th International Conference on
event_location: Monastir, Tunisia
event_dates: 21-23 December 2017
event_type: conference
refereed: TRUE
related_url_url: https://ieeexplore.ieee.org/document/8314952/
citation:   Abdallah, Abderazek Ben and Dang, Nam Khanh and Okuyama, Yuichi  (2017) A Low-overhead Fault tolerant Technique for TSV-based Interconnects in 3D-IC Systems.  In: Sciences and Techniques of Automatic Control and Computer Engineering (STA), 2017 18th International Conference on, 21-23 December 2017, Monastir, Tunisia.