<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof"^^ . "Embodiments provided are a through electrode that can be manufactured by a method not including the step of removing a side-wall insulating film formed at the bottom part of the through hole and so having improved electrical characteristics and mechanical reliability and a manufacturing method thereof as well as a semiconductor device and a manufacturing method thereof. A through electrode is disposed in a semiconductor substrate, and includes: a conductive layer; a side-wall insulating film that is disposed between the conductive layer and the semiconductor substrate, the side-wall insulating film being represented by the following chemical formula (1), and a tubular semiconductor layer disposed between the conductive layer and the semiconductor substrate, the semiconductor layer including a same material as the material of the semiconductor substrate."^^ . "2017-11-14" . . . . . . . . . . . . . . . . . . "Katsuya"^^ . "Kikuchi"^^ . "Katsuya Kikuchi"^^ . . "Naoya"^^ . "Watanabe"^^ . "Naoya Watanabe"^^ . . "Thanh Tung"^^ . "Bui"^^ . "Thanh Tung Bui"^^ . . "Masahiro"^^ . "Aoyagi"^^ . "Masahiro Aoyagi"^^ . . "Wei"^^ . "Feng"^^ . "Wei Feng"^^ . . . . . "HTML Summary of #3016 \n\nThrough electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof\n\n" . "text/html" . . . "Electronics and Computer Engineering"@en . .