<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "Through electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof"^^ . "Provided are a through electrode including an organic side-wall insulating film, capable of eliminating a barrier layer and achieving satisfactory mechanical reliability and electrical reliability and a manufacturing method thereof, and a semiconductor device and a manufacturing method thereof. According to one aspect of the present invention, a through electrode disposed in a semiconductor substrate is provided, including: a copper layer in the semiconductor substrate; and a side-wall insulating film that is disposed between the copper layer and the semiconductor substrate so as to be in contact with the copper layer and the semiconductor substrate, the side-wall insulating film being represented by the following chemical formula (1)."^^ . "2018-05-29" . . . . . . . . . . . . . . . . . . "Katsuya"^^ . "Kikuchi"^^ . "Katsuya Kikuchi"^^ . . "Naoya"^^ . "Watanabe"^^ . "Naoya Watanabe"^^ . . "Fumiki"^^ . "Kato"^^ . "Fumiki Kato"^^ . . "Thanh Tung"^^ . "Bui"^^ . "Thanh Tung Bui"^^ . . "Masahiro"^^ . "Aoyagi"^^ . "Masahiro Aoyagi"^^ . . . . . "HTML Summary of #3017 \n\nThrough electrode, manufacturing method thereof, and semiconductor device and manufacturing method thereof\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . .