@techreport{SisLab3244,
            type = {Technical Report},
           title = {The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2},
          author = {Phuong Hoai Nam Nguyen},
       publisher = {VNU University of Engineering and Technology},
            year = {2018},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3244/},
        abstract = {The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3\% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96\% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed.}
}