relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3244/
title: The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2
creator: Nguyen, Phuong Hoai Nam
subject: Engineering Physics
description: The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed.
publisher: VNU University of Engineering and Technology
date: 2018
type: Technical Report
type: NonPeerReviewed
format: application/pdf
language: en
identifier: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3244/1/Technical%20Report_%202018.pdf
identifier:   Nguyen, Phuong Hoai Nam  (2018) The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2.  Technical Report. VNU University of Engineering and Technology.    (In Press)