%0 Report
%9 Technical Report
%A Nguyen, Phuong Hoai Nam
%D 2018
%F SisLab:3244
%T The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3244/
%X The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed.