<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2"^^ . "The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed."^^ . "2018" . . . "VNU University of Engineering and Technology"^^ . . . . . . . "Phuong Hoai Nam"^^ . "Nguyen"^^ . "Phuong Hoai Nam Nguyen"^^ . . . . . . "The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2 (PDF)"^^ . . . "Technical Report_ 2018.pdf"^^ . . "HTML Summary of #3244 \n\nThe modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2\n\n" . "text/html" . . . "Engineering Physics" . .