TY  - INPR
ID  - SisLab3244
UR  - https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3244/
A1  - Nguyen, Phuong Hoai Nam
Y1  - 2018///
N2  - The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed.
PB  - VNU University of Engineering and Technology
M1  - technical_report
TI  - The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2
AV  - public
ER  -