%A Phuong Hoai Nam Nguyen
%T The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2
%X The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed.
%D 2018
%I VNU University of Engineering and Technology
%L SisLab3244