eprintid: 3244
rev_number: 10
eprint_status: archive
userid: 306
dir: disk0/00/00/32/44
datestamp: 2018-12-14 01:39:32
lastmod: 2018-12-21 01:12:18
status_changed: 2018-12-14 01:39:32
type: monograph
metadata_visibility: show
creators_name: Nguyen, Phuong Hoai Nam
creators_id: namnph@vnu.edu.vn
title: The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2
ispublished: inpress
subjects: Phys
divisions: fac_physic
abstract: The modification of nanosilica SiO2 to the curing of Bis phenol F epoxy resin (epoxy F) by triethyl tetraamine (TETA) was characterized. The curing properties of the nanocomposite epoxy F:SiO2 membranes are better than Bis phenol F epoxy films. With the content from 0,1 to 0,3% of SiO2 the films epoxy F:SiO2 show the excellent curing properties which get higher 96% of the gelation. The quantum size effect of nanosilica SiO2 was also discussed.
date: 2018
date_type: published
publisher: VNU University of Engineering and Technology
full_text_status: public
monograph_type: technical_report
citation:   Nguyen, Phuong Hoai Nam  (2018) The modification of the curing properties of Bis phenol F epoxy resin by nanosilica SiO2.  Technical Report. VNU University of Engineering and Technology.    (In Press)  
document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3244/1/Technical%20Report_%202018.pdf