@inproceedings{SisLab3640,
       booktitle = {IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)},
           month = {November},
           title = {2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults},
          author = {Nam Khanh Dang and Michael Meyer and Akram Ben Ahmed and Abderazek Ben Abdallah and Xuan Tu Tran},
            year = {2019},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3640/},
        abstract = {{--}Through-Silicon-Via (TSV) is one of the most
promising technologies to realize 3D Integrated Circuits (3D-
ICs). However, the reliability issues due to the low yield rates,
the sensitivity to thermal hotspots and stress issues due to the
difference in temperature between layers are preventing TSV-
based 3D-ICs from being widely and ef?ciently used. Due to
defect clustering, 3D-ICs could have multiple defects in the same
region which cannot be detected by using error correction codes
while dedicated testing could take a signi?cant number of testing
cycles. This paper presents a 2D Parity Product Code (2D-PPC)
with the ability to correct one fault and detect, at least, two
faults. With the extension using Orthogonal Latin Square, 2D-
PPC could detect multiple defects while reasonably increasing
the area cost and latency.}
}