<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults"^^ . "—Through-Silicon-Via (TSV) is one of the most\r\npromising technologies to realize 3D Integrated Circuits (3D-\r\nICs). However, the reliability issues due to the low yield rates,\r\nthe sensitivity to thermal hotspots and stress issues due to the\r\ndifference in temperature between layers are preventing TSV-\r\nbased 3D-ICs from being widely and efficiently used. Due to\r\ndefect clustering, 3D-ICs could have multiple defects in the same\r\nregion which cannot be detected by using error correction codes\r\nwhile dedicated testing could take a significant number of testing\r\ncycles. This paper presents a 2D Parity Product Code (2D-PPC)\r\nwith the ability to correct one fault and detect, at least, two\r\nfaults. With the extension using Orthogonal Latin Square, 2D-\r\nPPC could detect multiple defects while reasonably increasing\r\nthe area cost and latency."^^ . "2019-11" . . . . . . . . . . . . . . . . . . . . "Xuan Tu"^^ . "Tran"^^ . "Xuan Tu Tran"^^ . . "Nam Khanh"^^ . "Dang"^^ . "Nam Khanh Dang"^^ . . "Akram Ben"^^ . "Ahmed"^^ . "Akram Ben Ahmed"^^ . . "Abderazek Ben"^^ . "Abdallah"^^ . "Abderazek Ben Abdallah"^^ . . "Michael"^^ . "Meyer"^^ . "Michael Meyer"^^ . . . . "IEEE Asia Pacific Conference on Circuits and Systems (APCCAS)"^^ . . . . . "Bangkok"^^ . . . . . . "2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults (PDF)"^^ . . . "2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults (Other)"^^ . . . . . . "2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults (Other)"^^ . . . . . . "2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults (Other)"^^ . . . . . . "2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults (Other)"^^ . . . . . "HTML Summary of #3640 \n\n2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults\n\n" . "text/html" . . . "Electronics and Communications"@en . .