%A Nam Khanh Dang
%A Michael Meyer
%A Akram Ben Ahmed
%A Abderazek Ben Abdallah
%A Xuan Tu Tran
%T 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults
%X —Through-Silicon-Via (TSV) is one of the most
promising technologies to realize 3D Integrated Circuits (3D-
ICs). However, the reliability issues due to the low yield rates,
the sensitivity to thermal hotspots and stress issues due to the
difference in temperature between layers are preventing TSV-
based 3D-ICs from being widely and efficiently used. Due to
defect clustering, 3D-ICs could have multiple defects in the same
region which cannot be detected by using error correction codes
while dedicated testing could take a significant number of testing
cycles. This paper presents a 2D Parity Product Code (2D-PPC)
with the ability to correct one fault and detect, at least, two
faults. With the extension using Orthogonal Latin Square, 2D-
PPC could detect multiple defects while reasonably increasing
the area cost and latency.
%C Bangkok
%D 2019
%L SisLab3640