eprintid: 3640 rev_number: 10 eprint_status: archive userid: 375 dir: disk0/00/00/36/40 datestamp: 2019-12-04 05:45:07 lastmod: 2019-12-04 05:45:07 status_changed: 2019-12-04 05:45:07 type: conference_item metadata_visibility: show creators_name: Dang, Nam Khanh creators_name: Meyer, Michael creators_name: Ahmed, Akram Ben creators_name: Abdallah, Abderazek Ben creators_name: Tran, Xuan Tu creators_id: khanh.n.dang@vnu.edu.vn creators_id: tutx@vnu.edu.vn title: 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults ispublished: pub subjects: ECE divisions: fac_fet divisions: lab_sis abstract: —Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D- ICs). However, the reliability issues due to the low yield rates, the sensitivity to thermal hotspots and stress issues due to the difference in temperature between layers are preventing TSV- based 3D-ICs from being widely and efficiently used. Due to defect clustering, 3D-ICs could have multiple defects in the same region which cannot be detected by using error correction codes while dedicated testing could take a significant number of testing cycles. This paper presents a 2D Parity Product Code (2D-PPC) with the ability to correct one fault and detect, at least, two faults. With the extension using Orthogonal Latin Square, 2D- PPC could detect multiple defects while reasonably increasing the area cost and latency. date: 2019-11 date_type: published contact_email: khanh.n.dang@vnu.edu.vn full_text_status: restricted pres_type: paper event_title: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) event_location: Bangkok event_dates: 11-14 November 2019 event_type: conference refereed: TRUE citation: Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu (2019) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults. In: IEEE Asia Pacific Conference on Circuits and Systems (APCCAS), 11-14 November 2019, Bangkok. document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3640/1/c5_apccas.pdf