relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3641/
title: TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems
creator: Dang, Nam Khanh
creator: Ahmed, Akram Ben
creator: Abdallah, Abderazek Ben
creator: Tran, Xuan Tu
subject: Electronics and Communications
subject: Electronics and Computer Engineering
subject: Scopus-indexed journals
subject: ISI-indexed journals
description: In order to detect and localize TSV failures in  both manufacturing and operating phases, most of the existing  methods use a dedicated testing mechanism with long response  time and prerequisite interruptions for on-line testing. This paper  presents an ECC-based method named “Through-Silicon-Via On  Communication Test” (TSV-OCT) to detect and localize faults  without halting the operation of TSV-based 3D-IC systems. We  first propose Statistical Detector, a method to detect open and  short defects in TSVs that work in parallel with data transactions.  Second, we propose an Isolation and Check algorithm to enhance  the localization ability of the method. Moreover, the Monte-Carlo  simulations show that the proposed Statistical Detector increases  ×2 the number of detected faults when compared to conventional  ECC-based techniques. With the help of Isolation and Check,  TSV-OCT localizes the number of defects up to ×4 and ×5  higher. In addition, the response time is kept below 65,000 cycles  which could be easily integrated into real-time applications. On  the other hand, an implementation of TSV-OCT on a 3D Network-  on-Chip router shows no performance degradation for testing  while having a reasonable area overhead.
publisher: IEEE
date: 2019
type: Article
type: PeerReviewed
format: application/pdf
language: en
identifier: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3641/1/10.1109%40TVLSI.2019.2948878.pdf
identifier:   Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2019) TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems.  IEEE Transactions on Very Large Scale Integration (VLSI) Systems .    ISSN 1063-8210     
relation: https://ieeexplore.ieee.org/document/8894077
relation: 10.1109/TVLSI.2019.2948878