TY  - JOUR
ID  - SisLab3641
UR  - https://ieeexplore.ieee.org/document/8894077
A1  - Dang, Nam Khanh
A1  - Ahmed, Akram Ben
A1  - Abdallah, Abderazek Ben
A1  - Tran, Xuan Tu
Y1  - 2019///
N2  - In order to detect and localize TSV failures in
both manufacturing and operating phases, most of the existing
methods use a dedicated testing mechanism with long response
time and prerequisite interruptions for on-line testing. This paper
presents an ECC-based method named ?Through-Silicon-Via On
Communication Test? (TSV-OCT) to detect and localize faults
without halting the operation of TSV-based 3D-IC systems. We
?rst propose Statistical Detector, a method to detect open and
short defects in TSVs that work in parallel with data transactions.
Second, we propose an Isolation and Check algorithm to enhance
the localization ability of the method. Moreover, the Monte-Carlo
simulations show that the proposed Statistical Detector increases
×2 the number of detected faults when compared to conventional
ECC-based techniques. With the help of Isolation and Check,
TSV-OCT localizes the number of defects up to ×4 and ×5
higher. In addition, the response time is kept below 65,000 cycles
which could be easily integrated into real-time applications. On
the other hand, an implementation of TSV-OCT on a 3D Network-
on-Chip router shows no performance degradation for testing
while having a reasonable area overhead.
PB  - IEEE
JF  - IEEE Transactions on Very Large Scale Integration (VLSI) Systems
SN  - 1063-8210
TI  - TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems
AV  - public
ER  -