eprintid: 3641
rev_number: 12
eprint_status: archive
userid: 375
dir: disk0/00/00/36/41
datestamp: 2019-11-29 15:24:35
lastmod: 2019-12-06 08:02:30
status_changed: 2019-11-29 15:24:35
type: article
metadata_visibility: no_search
creators_name: Dang, Nam Khanh
creators_name: Ahmed, Akram Ben
creators_name: Abdallah, Abderazek Ben
creators_name: Tran, Xuan Tu
creators_id: dnk0904@gmail.com
creators_id: benab@u-aizu.ac.jp
creators_id: tutx@vnu.edu.vn
title: TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
subjects: Scopus
subjects: isi
divisions: fac_fit
divisions: lab_sis
abstract: In order to detect and localize TSV failures in
both manufacturing and operating phases, most of the existing
methods use a dedicated testing mechanism with long response
time and prerequisite interruptions for on-line testing. This paper
presents an ECC-based method named “Through-Silicon-Via On
Communication Test” (TSV-OCT) to detect and localize faults
without halting the operation of TSV-based 3D-IC systems. We
first propose Statistical Detector, a method to detect open and
short defects in TSVs that work in parallel with data transactions.
Second, we propose an Isolation and Check algorithm to enhance
the localization ability of the method. Moreover, the Monte-Carlo
simulations show that the proposed Statistical Detector increases
×2 the number of detected faults when compared to conventional
ECC-based techniques. With the help of Isolation and Check,
TSV-OCT localizes the number of defects up to ×4 and ×5
higher. In addition, the response time is kept below 65,000 cycles
which could be easily integrated into real-time applications. On
the other hand, an implementation of TSV-OCT on a 3D Network-
on-Chip router shows no performance degradation for testing
while having a reasonable area overhead.
date: 2019
date_type: published
publisher: IEEE
official_url: https://ieeexplore.ieee.org/document/8894077
id_number: 10.1109/TVLSI.2019.2948878
full_text_status: public
publication: IEEE Transactions on Very Large Scale Integration (VLSI) Systems
refereed: TRUE
issn: 1063-8210
funders: NAFOSTED
citation:   Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2019) TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC Systems.  IEEE Transactions on Very Large Scale Integration (VLSI) Systems .    ISSN 1063-8210     
document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3641/1/10.1109%40TVLSI.2019.2948878.pdf