eprintid: 3927
rev_number: 10
eprint_status: archive
userid: 375
dir: disk0/00/00/39/27
datestamp: 2020-01-31 08:00:30
lastmod: 2020-02-03 06:57:19
status_changed: 2020-01-31 08:00:30
type: article
metadata_visibility: no_search
creators_name: Dang, Nam Khanh
creators_name: Meyer, Michael
creators_name: Ahmed, Akram Ben
creators_name: Abdallah, Abderazek Ben
creators_name: Tran, Xuan Tu
creators_id: dnk0904@gmail.com
creators_id: benab@u-aizu.ac.jp
creators_id: tutx@vnu.edu.vn
title: 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
subjects: IT
abstract: Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs). 
However, the reliability issues due to the low yield rates and the sensitivity to thermal hotspots and stress issues are preventing TSV-based 3D-ICs from being widely and efficiently used. To enhance the reliability of TSV connections, using error correction code to detect and correct faults automatically has been demonstrated as a viable solution.
This paper presents a 2D Parity Product Code (2D-PPC) for TSV fault-tolerance with the ability to correct one fault and detect, at least, two faults. 
In an implementation of 64-bit data and 81-bit code-word, 2D-PPC can detect over 71 faults, on average. 
Its encoder and decoder decrease the overall latency by 38.33\% when compared to the Single Error Correction Double Error Detection code. 
In addition to the high detection rates, the encoder can detect 100\% of its gate failures, and the decoder can detect and correct around 40\% of its individual gate failures. The squared 2D-PPC could be extended using orthogonal Latin square to support extra bit correction.
date: 2020
date_type: published
full_text_status: public
publication: REV Journal on Electronics and Communications
refereed: TRUE
funders: NAFOSTED
citation:   Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2020) 2D-PPC: A single-correction multiple-detection method for Through-Silicon-Via Faults.  REV Journal on Electronics and Communications .        
document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3927/1/jec_224.pdf