TY  - JOUR
ID  - SisLab3947
UR  - https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3947/
IS  - 1-2
A1  - Dang, Nam Khanh
A1  - Meyer, Michael
A1  - Ahmed, Akram Ben
A1  - Abdallah, Abderazek Ben
A1  - Tran, Xuan Tu
Y1  - 2020/04/23/
N2  - Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs).However,  the  reliability  issues  due  to  the  low  yield  rates  and  the  sensitivity  to  thermal  hotspots  and  stress  issues  arepreventing TSV-based 3D-ICs from being widely and efficiently used. To enhance the reliability of TSV connections, usingerror  correction  code  to  detect  and  correct  faults  automatically  has  been  demonstrated  as  a  viable  solution.  This  paperpresents a 2D Parity Product Code (2D-PPC) for TSV fault-tolerance with the ability to correct one fault and detect, at least,two  faults.  In  an  implementation  of  64-bit  data  and  81-bit  code-word,  2D-PPC  can  detect  over  71  faults,  on  average.  Itsencoder  and  decoder  decrease  the  overall  latency  by  38.33%  when  compared  to  the  Single  Error  Correction  Double  ErrorDetection  code.  In  addition  to  the  high  detection  rates,  the  encoder  can  detect  100%  of  its  gate  failures,  and  the  decodercan detect and correct around 40% of its individual gate failures. The squared 2D-PPC could be extended using orthogonalLatin square to support extra bit correction
JF  - REV Journal on Electronics and Communications
VL  - 10
TI  - 2D Parity Product Code for TSV Online Fault Correction and Detection
SP  - 11
AV  - public
EP  - 21
ER  -