eprintid: 3947
rev_number: 17
eprint_status: archive
userid: 375
dir: disk0/00/00/39/47
datestamp: 2020-05-04 03:38:16
lastmod: 2020-05-04 03:38:16
status_changed: 2020-05-04 03:38:16
type: article
succeeds: 3927
metadata_visibility: show
creators_name: Dang, Nam Khanh
creators_name: Meyer, Michael
creators_name: Ahmed, Akram Ben
creators_name: Abdallah, Abderazek Ben
creators_name: Tran, Xuan Tu
creators_id: dnk0904@gmail.com
creators_id: benab@u-aizu.ac.jp
creators_id: tutx@vnu.edu.vn
title: 2D Parity Product Code for TSV Online Fault Correction and Detection
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
subjects: IT
divisions: lab_sis
abstract: Through-Silicon-Via (TSV) is one of the most promising technologies to realize 3D Integrated Circuits (3D-ICs).However,  the  reliability  issues  due  to  the  low  yield  rates  and  the  sensitivity  to  thermal  hotspots  and  stress  issues  arepreventing TSV-based 3D-ICs from being widely and efficiently used. To enhance the reliability of TSV connections, usingerror  correction  code  to  detect  and  correct  faults  automatically  has  been  demonstrated  as  a  viable  solution.  This  paperpresents a 2D Parity Product Code (2D-PPC) for TSV fault-tolerance with the ability to correct one fault and detect, at least,two  faults.  In  an  implementation  of  64-bit  data  and  81-bit  code-word,  2D-PPC  can  detect  over  71  faults,  on  average.  Itsencoder  and  decoder  decrease  the  overall  latency  by  38.33%  when  compared  to  the  Single  Error  Correction  Double  ErrorDetection  code.  In  addition  to  the  high  detection  rates,  the  encoder  can  detect  100%  of  its  gate  failures,  and  the  decodercan detect and correct around 40% of its individual gate failures. The squared 2D-PPC could be extended using orthogonalLatin square to support extra bit correction
date: 2020-04-23
date_type: published
full_text_status: public
publication: REV Journal on Electronics and Communications
volume: 10
number: 1-2
pagerange: 11-21
refereed: TRUE
related_url_url: https://www.rev-jec.org/index.php/rev-jec/article/view/242/198
funders: NAFOSTED
citation:   Dang, Nam Khanh and Meyer, Michael and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2020) 2D Parity Product Code for TSV Online Fault Correction and Detection.  REV Journal on Electronics and Communications, 10  (1-2).   pp. 11-21.      
document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3947/1/rev-jec_224.pdf