relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3960/
title: Thermal distribution and reliability prediction for 3D Networks-on-Chip
creator: Dang, Nam Khanh
creator: Ahmed, Akram Ben
creator: Abdallah, Abderazek Ben
creator: Tran, Xuan Tu
subject: Electronics and Communications
subject: Electronics and Computer Engineering
publisher: VNU Journal of Science
date: 2020-06
type: Article
type: PeerReviewed
format: application/pdf
language: en
identifier: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3960/1/J8_HOTCLUSTER_PLATFORM_SUB.pdf
identifier:   Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip.  VNU Journal of Computer Science and Communication Engineering .    ISSN 0866-8612