<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "Thermal distribution and reliability prediction for 3D Networks-on-Chip"^^ . "2020-06" . . . "VNU Journal of Science"^^ . . . "VNU Journal of Computer Science and Communication Engineering"^^ . . . "08668612" . . . . . . . . . . . . . . . . "Abderazek Ben"^^ . "Abdallah"^^ . "Abderazek Ben Abdallah"^^ . . "Xuan Tu"^^ . "Tran"^^ . "Xuan Tu Tran"^^ . . "Akram Ben"^^ . "Ahmed"^^ . "Akram Ben Ahmed"^^ . . "Nam Khanh"^^ . "Dang"^^ . "Nam Khanh Dang"^^ . . . . . . "Thermal distribution and reliability prediction for 3D Networks-on-Chip (PDF)"^^ . . . "Thermal distribution and reliability prediction for 3D Networks-on-Chip (Other)"^^ . . . . . . "Thermal distribution and reliability prediction for 3D Networks-on-Chip (Other)"^^ . . . . . . "Thermal distribution and reliability prediction for 3D Networks-on-Chip (Other)"^^ . . . . . . "Thermal distribution and reliability prediction for 3D Networks-on-Chip (Other)"^^ . . . . . "HTML Summary of #3960 \n\nThermal distribution and reliability prediction for 3D Networks-on-Chip\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . .