eprintid: 3960
rev_number: 10
eprint_status: archive
userid: 375
dir: disk0/00/00/39/60
datestamp: 2020-06-05 02:03:28
lastmod: 2020-06-05 02:03:28
status_changed: 2020-06-05 02:03:28
type: article
metadata_visibility: no_search
creators_name: Dang, Nam Khanh
creators_name: Ahmed, Akram Ben
creators_name: Abdallah, Abderazek Ben
creators_name: Tran, Xuan Tu
creators_id: dnk0904@gmail.com
creators_id: benab@u-aizu.ac.jp
creators_id: tutx@vnu.edu.vn
title: Thermal distribution and reliability prediction for 3D Networks-on-Chip
ispublished: pub
subjects: ECE
subjects: ElectronicsandComputerEngineering
divisions: lab_sis
date: 2020-06
date_type: published
publisher: VNU Journal of Science
contact_email: khanh.n.dang@vnu.edu.vn
full_text_status: restricted
publication: VNU Journal of Computer Science and Communication Engineering
refereed: TRUE
issn: 0866-8612
funders: NAFOSTED
citation:   Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2020) Thermal distribution and reliability prediction for 3D Networks-on-Chip.  VNU Journal of Computer Science and Communication Engineering .    ISSN 0866-8612     
document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/3960/1/J8_HOTCLUSTER_PLATFORM_SUB.pdf