@misc{SisLab4044,
           month = {June},
           title = {?????????????????????????????
TSV Error Tolerant Router Device for 3D Network On Chip},
          author = {Abderazek Ben Abdallah and Nam Khanh Dang and Masayuki Hisada},
            year = {2019},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4044/},
        abstract = {A TSV error tolerant router device for 3D network-on-chip is disclosed. In a TSV error tolerant router device for a 3D network-on-chip having a plurality of routers arranged in each of a plurality of layers, and routers between the layers are connected by through-silicon vias, the through-silicon vias are provided. Each of which belongs to one corresponding router, has a plurality of clusters around the corresponding router, and is adjacent to the corresponding router when one of the plurality of clusters belonging to the corresponding router is defective A router is selected, and one cluster of the selected router is replaced in place of the defective cluster, maintaining connectivity between the layers. [Selection] Figure 2}
}