relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4044/
title: ３ｄネットワークオンチップのためのｔｓｖ誤り耐容ルータ装置  TSV Error Tolerant Router Device for 3D Network On Chip
creator: Abdallah, Abderazek Ben
creator: Dang, Nam Khanh
creator: Hisada, Masayuki
subject: Electronics and Communications
subject: Electronics and Computer Engineering
description: A TSV error tolerant router device for 3D network-on-chip is disclosed. In a TSV error tolerant router device for a 3D network-on-chip having a plurality of routers arranged in each of a plurality of layers, and routers between the layers are connected by through-silicon vias, the through-silicon vias are provided. Each of which belongs to one corresponding router, has a plurality of clusters around the corresponding router, and is adjacent to the corresponding router when one of the plurality of clusters belonging to the corresponding router is defective A router is selected, and one cluster of the selected router is replaced in place of the defective cluster, maintaining connectivity between the layers. [Selection] Figure 2
date: 2019-06-13
type: Patent
type: NonPeerReviewed
format: application/pdf
language: en
identifier: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4044/1/JP2019092020A.pdf
identifier:   Univ of Aizu, Aizu Laboratory Inc  (2019) ３ｄネットワークオンチップのためのｔｓｖ誤り耐容ルータ装置 TSV Error Tolerant Router Device for 3D Network On Chip.  JP2019092020A.   
relation: https://patents.google.com/patent/JP2019092020A/en
relation: JP2019092020A