%0 Patent
%@ JP2019092020A
%A Abdallah, Abderazek Ben
%A Dang, Nam Khanh
%A Hisada, Masayuki
%A University of Aizu,
%A VNU University of Engineering,
%A Aizu Laboratory Inc,
%D 2019
%F SisLab:4044
%T ３ｄネットワークオンチップのためのｔｓｖ誤り耐容ルータ装置  TSV Error Tolerant Router Device for 3D Network On Chip
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4044/
%X A TSV error tolerant router device for 3D network-on-chip is disclosed. In a TSV error tolerant router device for a 3D network-on-chip having a plurality of routers arranged in each of a plurality of layers, and routers between the layers are connected by through-silicon vias, the through-silicon vias are provided. Each of which belongs to one corresponding router, has a plurality of clusters around the corresponding router, and is adjacent to the corresponding router when one of the plurality of clusters belonging to the corresponding router is defective A router is selected, and one cluster of the selected router is replaced in place of the defective cluster, maintaining connectivity between the layers. [Selection] Figure 2