@inproceedings{SisLab4048,
       booktitle = {2020 International Conference On Advanced Technologies for Communications (ATC)},
           month = {October},
           title = {A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs},
          author = {Nam Khanh Dang and Akram Ben Ahmed and Fakhrul Zaman Rokhani and Abderazek Ben Abdallah and Xuan Tu Tran},
            year = {2020},
             url = {https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4048/}
}