relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4048/
title: A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs
creator: Dang, Nam Khanh
creator: Ahmed, Akram Ben
creator: Rokhani, Fakhrul Zaman
creator: Abdallah, Abderazek Ben
creator: Tran, Xuan Tu
subject: Electronics and Communications
subject: ISI/Scopus indexed conference
date: 2020-10
type: Conference or Workshop Item
type: PeerReviewed
format: application/pdf
language: en
identifier: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4048/1/2020_ATC_HOTSTACK.pdf
identifier:   Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs.  In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.     
relation: http://atc-conf.org/