%0 Conference Paper
%A Dang, Nam Khanh
%A Ahmed, Akram Ben
%A Rokhani, Fakhrul Zaman
%A Abdallah, Abderazek Ben
%A Tran, Xuan Tu
%B 2020 International Conference On Advanced Technologies for Communications (ATC)
%C Nha Trang
%D 2020
%F SisLab:4048
%T A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs
%U https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4048/