eprintid: 4048
rev_number: 11
eprint_status: archive
userid: 375
dir: disk0/00/00/40/48
datestamp: 2020-09-07 08:18:12
lastmod: 2020-11-23 02:36:23
status_changed: 2020-09-07 08:18:12
type: conference_item
metadata_visibility: show
creators_name: Dang, Nam Khanh
creators_name: Ahmed, Akram Ben
creators_name: Rokhani, Fakhrul Zaman
creators_name: Abdallah, Abderazek Ben
creators_name: Tran, Xuan Tu
creators_id: dnk0904@gmail.com
creators_id: benab@u-aizu.ac.jp
creators_id: tutx@vnu.edu.vn
title: A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs
ispublished: pub
subjects: ECE
subjects: isi_scopus_conf
divisions: lab_sis
date: 2020-10
date_type: published
official_url: http://atc-conf.org/
contact_email: khanh.n.dang@vnu.edu.vn
full_text_status: restricted
pres_type: paper
event_title: 2020 International Conference On Advanced Technologies for Communications (ATC)
event_location: Nha Trang
event_dates: 8-10 October 2020
event_type: conference
refereed: TRUE
citation:   Dang, Nam Khanh and Ahmed, Akram Ben and Rokhani, Fakhrul Zaman and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2020) A thermal distribution, lifetime reliability prediction and spare TSV insertion platform for stacking 3D NoCs.  In: 2020 International Conference On Advanced Technologies for Communications (ATC), 8-10 October 2020, Nha Trang.     
document_url: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4048/1/2020_ATC_HOTSTACK.pdf