relation: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4049/
title: A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems
creator: Dang, Nam Khanh
creator: Ahmed, Akram Ben
creator: Abdallah, Abderazek Ben
creator: Tran, Xuan Tu
subject: Communications
subject: Electronics and Communications
subject: Electronics and Computer Engineering
subject: Information Technology (IT)
subject: Scopus-indexed journals
subject: ISI-indexed journals
description: Through-Silicon-Via (TSV) based 3D Integrated Circuits (3D-IC) are one of the most advanced architectures by providing low power consumption, shorter wire length and smaller footprint. However, 3D-ICs confront lifetime reliability due to high operating temperature and interconnect reliability, especially the Through-Silicon-Via (TSV), which can significantly affect the accuracy of the applications. In this paper, we present an online method that supports the detection and correction of lifetime TSV failures, named IaSiG. By reusing the conventional recovery method and analyzing the output syndromes, IaSiG can determine and correct the defective TSVs. Results show that within a group, $R$ redundant TSVs can fully localize and correct $R$ defects and support the detection of $R+1$ defects. 	Moreover, by using $G$ groups, it can localize up to GxR and detect up to Gx(R+1) defects. An implementation of IaSiG for 32-bit data in eight groups and two redundancies has a worst-case execution time (WCET) of 5,152 cycles while supporting at most 16 defective TSVs (50\% localization).   By integrating IaSiG onto a 3D Network-on-Chip, we also perform a grid-search based empirical method to insert suitable numbers of redundancies into TSV groups. The empirical method takes the operating temperature as the factor of accelerated fault due to the fact that temperature is one of the major issues of 3D-ICs. The results show that the proposed method can reduce the number of redundancies from the uniform method while still maintaining the required Mean Time to Failure.
publisher: IEEE
date: 2020-09
type: Article
type: PeerReviewed
format: application/pdf
language: en
identifier: https://eprints.uet.vnu.edu.vn/eprints/id/eprint/4049/1/FINAL%20Article.pdf
identifier:   Dang, Nam Khanh and Ahmed, Akram Ben and Abdallah, Abderazek Ben and Tran, Xuan Tu  (2020) A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems.  IEEE Access, 8 .   pp. 166642-166657.  ISSN 2169-3536     
relation: https://ieeexplore.ieee.org/document/9189765
relation: 10.1109/ACCESS.2020.3022904