?url_ver=Z39.88-2004&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Ajournal&rft.au=Dang%2C+Nam+Khanh&rft.aulast=Dang&rft.aufirst=Nam+Khanh&rft.date=31+March+2021&rft.issn=0278-0070&rft.atitle=HotCluster%3A+A+thermal-aware+defect+recovery+method+for+Through-Silicon-Vias+Towards+Reliable+3-D+ICs+systems&rft.title=IEEE+Transactions+on+Computer-Aided+Design+of+Integrated+Circuits+and+Systems&rft.genre=article