<> "The repository administrator has not yet configured an RDF license."^^ . <> . . . "HotCluster: A thermal-aware defect recovery\r\nmethod for Through-Silicon-Vias Towards Reliable\r\n3-D ICs systems"^^ . "Through Silicon Via (TSV) is considered as the\r\nnear-future solution to realize low-power and high-performance\r\n3D-Integrated Circuits (3D-ICs) and 3D-Network-on-Chips (3DNoCs). However, the lifetime reliability issue of TSV due to\r\nits fault sensitivity and the high operating temperature of\r\n3D-ICs, which also accelerates the fault-rate, is one of the\r\nmost critical challenges. Meanwhile, most current works focus\r\non detecting and correcting TSV defects after manufacturing\r\nwithout considering high-temperature nodes’ impact on lifetime\r\nreliability. Besides, the recovery for defective clusters is also\r\nchallenging because of costly redundancies. In this work, we\r\npresent HotCluster: a hotspot-aware self-correction platform for\r\nclustering defects in 3D-NoCs to help understand and tackle\r\nthis problem. We first give a method to predict normalized fault\r\nrates and place redundant TSV groups according to each region’s\r\nfault rate. In our particular medium fault-rate (normalized to the\r\ncoolest area), HotCluster reduces about 60% of the redundancies\r\nin comparison to the uniformly distributed redundancies while\r\nhaving a higher ratio of router working in a normal state. Furthermore, HotCluster integrates both online (weight-based) and\r\noffline (max-flow min-cut offline method) mapping algorithms to\r\nhelp the system correct the faulty TSV clusters. The experimental\r\nresults show that both the max-flow min-cut offline method and\r\nweight-based online mode with a redundancy of 0.25 exhibits less\r\nthan 1% of routers disabled under 50% defect-rates."^^ . "2021-03-31" . . . "IEEE"^^ . . . "IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"^^ . . . "02780070" . . . . . . . . . . . . . . . . "Abderazek Ben"^^ . "Abdallah"^^ . "Abderazek Ben Abdallah"^^ . . "Akram Ben"^^ . "Ahmed"^^ . "Akram Ben Ahmed"^^ . . "Xuan Tu"^^ . "Tran"^^ . "Xuan Tu Tran"^^ . . "Nam Khanh"^^ . "Dang"^^ . "Nam Khanh Dang"^^ . . . . . . "HotCluster: A thermal-aware defect recovery\r\nmethod for Through-Silicon-Vias Towards Reliable\r\n3-D ICs systems (PDF)"^^ . . . "HotCluster: A thermal-aware defect recovery\r\nmethod for Through-Silicon-Vias Towards Reliable\r\n3-D ICs systems (Other)"^^ . . . . . . "HotCluster: A thermal-aware defect recovery\r\nmethod for Through-Silicon-Vias Towards Reliable\r\n3-D ICs systems (Other)"^^ . . . . . . "HotCluster: A thermal-aware defect recovery\r\nmethod for Through-Silicon-Vias Towards Reliable\r\n3-D ICs systems (Other)"^^ . . . . . . "HotCluster: A thermal-aware defect recovery\r\nmethod for Through-Silicon-Vias Towards Reliable\r\n3-D ICs systems (Other)"^^ . . . . . "HTML Summary of #4430 \n\nHotCluster: A thermal-aware defect recovery \nmethod for Through-Silicon-Vias Towards Reliable \n3-D ICs systems\n\n" . "text/html" . . . "Electronics and Communications"@en . . . "Electronics and Computer Engineering"@en . . . "ISI-indexed journals"@en . .